through-hole technology

Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction.

PLCC sockets may in turn be surface mounted, or use through-hole technology.

In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board.

Classical printed circuit board (PCB) material can be used (this method is typically used with through-hole technology components).

Through-hole technology (THT)

The chips are mounted on the "CPU planar", a printed circuit board (PCB), using through-hole technology.

Through-hole technology and its use in multi-layer PCBs were patented by the U.S. firm Hazeltyne in 1961.

The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side.

However, there is still significant wave soldering where SMT is not suitable (e.g., large power devices and high pin count connectors), or where simple through-hole technology prevails (certain major appliances).