breaking stress
crippling stress

The result is the breaking stress.

The maximum transverse breaking stress applied under specified conditions, that a material will withstand before fracture.

Clearly, the efficiency needs to be improved, but the device solves all of the major problems inherent to the previous design: the nanowires are not exposed to breaking stresses and the laterally packaged device is easily sealed.

The paint cracks when the stress upon it is greater than the breaking stress point of the paint layer and the paint will crack approximately at right-angles to the direction of the stress, relieving that stress.

In RTP-1 specifications, the primary concerns relate stress and strain, such as hoop stress, axial stress, and breaking stress to the physical properties of the material, such as Young's modulus (which may require an anisotropic analysis due to the filament winding process).