interposer

These balls were adjusted to have enough horizontal space for only one interposer to enter at a time.

An interposer is an electrical interface routing between one socket or connection to another.

Interposer comes from the Latin, interpōnere, meaning 'to put up between.'

Be interposer 'twixt us Twain."

The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.

It distinctively used a ceramic interposer much like the Thunderbird instead of the organic pin grid array package used on all later Palomino processors.

A common example of an interposer is an integrated circuit die to BGA, such as in the Pentium II.

The individual FPGA dice are conventional, and are flip-chip mounted by microbumps on to the interposer.

Another example of an interposer would be the adapter used to allow a SATA drive to work in a SAS environment.

An interposer would allow a SATA drive to plug into a SAS backplane, providing path redundancy.

Because no interposer is required, a TSV 3D package can also be flatter than an edge-wired 3D package.

The technology stacks several (three or four) active FPGA dice side-by-side on a silicon interposer - a single piece of silicon that carries passive interconnect.

Another source, SemiAccurate, however says that the GT3 will have 40 EUs with an accompanying 64 MB cache on an interposer.

When a key was depressed, an interposer, beneath the keylever, was pushed down into a slotted tube full of small metal balls (called the "compensator tube") and spring latched.

The interposer provides direct interconnect between the FPGA dice, with no need for transceiver technologies such as high-speed SERDES.

The interposer provides 10,000 data pathways between the individual FPGAs - roughly 10 to 100 times more than would usually be available on a board - to create a single FPGA.

"The word Gazelem appears to have its roots in Gaz - a stone and Aleim, a name of God as a revelator or interposer in the affairs of men.

The bars, Irons, and Dies have various configurations and can be covered with a release layer or utilize various slick interposer materials (i.e. Teflon films) to prevent sticking to the hot tooling.

In most 3D packages, the stacked chips are wired together along their edges; this edge wiring slightly increases the length and width of the package and usually requires an extra "interposer" layer between the chips.

Pressing two keys several milliseconds apart allows the first interposer to enter the tube, tripping a clutch which rotated a fluted shaft driving the interposer horizontally and out of the tube.

An additional source, AnandTech, agrees that GT3 will have 40 EUs, and states there will be a version with up to 128 MB of embedded DRAM, but makes no mention of an interposer.

No need for SATA interposer cards (for high availability of SATA drives SATA interposer cards are needed)

The powered horizontal motion of the interposer selected the appropriate rotate and tilt of the printhead for character selection, but also made way for the second interposer to enter the tube some milliseconds later, well before the first character had been printed.

In 2011, Xilinx began shipping sample quantities of the Virtex-7 2000T FPGA, which combines four smaller FPGAs into a single package by placing them on a special silicon interconnection pad (called an interposer) to deliver 6.8 billion transistors in a single large chip.